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Componenti

• Procedure di assemblaggio GPO/GPPO (Corning Gilbert)
• Application notes su terminazioni e resistenze (Aeroflex/KDI)
• Improving return loss of Bi-conical antennas (MEC)
• Optimizing test boards for 50 GHz end launchers connectors (Southwest Microwave)

Moduli

• Technical resources (Bliley)
• Application of microwave fiber optic communications (Linear Photonics)
• Directional couplers as signal combiners (Microlab/FXR)
• YIG filters product description (Micro Lambda Wireless)

Microelettronica

• Thinfilm design guidelines (ATP)
• Btech : Thermoplastic film bonding
• Where Hybond fits in the process
• Optiprint technical informations
• RJR Polymers : Jedec packaging

Sistemi e Software

• Industrial controls with 2.4 GHz radios (Aerocomm by Laird Technologies)
• CST STUDIO SUITE : filter demo
• Teledyne MEC : TWT applications notes